Senior PCB Layout Engineer

Qorvo ยท ๐Ÿ“ Canggu,Ubud,Denpasar,Jimbaran,Nusa Dua,Kuta,Badung ยท Diposting 2026-10-09
FULL_TIMEโญ TERVERIFIKASI
USD 50000 - 80000
Qorvo is seeking a highly skilled and experienced Senior PCB Layout Engineer to join our team in Bali. As a Senior PCB Layout Engineer, you will be responsible for designing and developing high-quality printed circuit boards (PCBs) for our advanced RF and microwave products. This role offers the opportunity to work on cutting-edge technology in a dynamic and innovative environment.

๐Ÿ“‹ Tanggung Jawab Pekerjaan

Design and develop high-performance printed circuit boards (PCBs) for RF and microwave applications.,Collaborate with cross-functional teams to ensure PCB designs meet performance, reliability, and manufacturability requirements.,Conduct design reviews and provide technical guidance to junior engineers.,Stay up-to-date with the latest PCB design tools, technologies, and industry trends.,Troubleshoot and resolve PCB design issues to ensure optimal performance and reliability.,Work closely with manufacturing teams to ensure PCB designs are manufacturable and meet quality standards.,Develop and maintain design documentation, including schematics, layout drawings, and BOMs.,Participate in product development cycles from concept to production.

๐ŸŽ“ Kualifikasi & Syarat

Bachelor's degree in Electrical Engineering or related field.,5+ years of experience in PCB layout design, preferably in RF and microwave applications.,Proficient in PCB design tools such as Altium Designer, Cadence Allegro, or Mentor Graphics PADS.,Strong understanding of PCB design principles, including signal integrity, power integrity, and electromagnetic compatibility (EMC).,Experience with PCB fabrication processes and materials.,Excellent problem-solving skills and attention to detail.,Ability to work in a fast-paced, collaborative environment.,Strong communication and technical writing skills.

๐Ÿ› ๏ธ Keahlian

PCB design tools (Altium DesignerCadence AllegroMentor Graphics PADS)RF and microwave design principlesSignal integrity and power integrity analysisElectromagnetic compatibility (EMC) considerationsPCB fabrication processes and materialsDesign for manufacturability (DFM)Technical documentation and reportingTeam collaboration and leadership
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